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Senior Staff R&D Design Technology Integration Engineer (WLP, Bump, Die Sort)

QualcommSingaporePosted 17 May 2026

Qualcomm is seeking a Senior Staff R&D Design Technology Integration Engineer in Singapore to support RF front-end modules. The role involves leading technology integration for advanced packaging, Si/GaAs backend interconnects, and flip-chip processes. You will collaborate cross-functionally with foundries and OSATs to optimize yield, quality, and reliability. This position requires deep expertise in semiconductor assembly and process integration to drive product readiness and ramp-up success.

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Experience

5+ years

Function

Engineering

Work mode

Onsite, Singapore

Company

Tier 1

What you will work on

Qualcomm is seeking a Senior Staff R&D Design Technology Integration Engineer in Singapore to support RF front-end modules. The role involves leading technology integration for advanced packaging, Si/GaAs backend interconnects, and flip-chip processes. You will collaborate cross-functionally with foundries and OSATs to optimize yield, quality, and reliability. This position requires deep expertise in semiconductor assembly and process integration to drive product readiness and ramp-up success.

TAL's take

Quality 85/1005/5 clarityTier 1 company

High-tier global semiconductor company offering a senior technical leadership role in RF packaging.

JD provides clear technical focus areas, specific manufacturing methodologies, and explicit educational and experience requirements.

Salaries at Qualcomm

27.4 LPA average

Based on 637 Grapevine salary entries for Qualcomm.

View all salaries

Engineering

0 - 2 years | L1

15 LPA average

Range: 12 - 20 LPA

Engineering

2 - 4 years | L1

18 LPA average

Range: 8 - 32 LPA

Engineering

4 - 6 years | L1

21 LPA average

Range: 10 - 31 LPA

Engineering

6 - 8 years | Lead

30 LPA average

Range: 20 - 50 LPA

Must haves

  • 10+ years electronics packaging experience preferred
  • 5+ years process engineering or product integration
  • Knowledge of backend-of-the-line processes
  • Proficiency in design of experiments
  • Understanding of semiconductor packaging materials and failure mechanisms
  • Excellent communication skills

Tools and skills

semiconductor packaging materialsbeol processesflip chip packagingspcfmeadesign of experimentsprocess engineering

Nice to have: photolithography, pcb design, layout tools.

About the company

Qualcomm is a global leader in the semiconductor and wireless telecommunications industry.

Posts mentioning Qualcomm