Senior /Lead Research Engineer (FOWLP/2.5D/3D package integration) (HI), IME
A*STAR is seeking a Senior Research Engineer to lead advanced packaging platform technologies for 2.5D/3D IC integration. The role involves developing process integration flows for heterogeneous chiplets, working with cross-functional teams, and managing stakeholder engagements. Candidates must have deep expertise in Cu backend integration and NPI to HVM ramp. The position offers access to state-of-the-art lab facilities and opportunities for research publication.
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Experience
5-10 years
Function
Research
Work mode
Onsite, Singapore
Company
Tier 2
What you will work on
A*STAR is seeking a Senior Research Engineer to lead advanced packaging platform technologies for 2.5D/3D IC integration. The role involves developing process integration flows for heterogeneous chiplets, working with cross-functional teams, and managing stakeholder engagements. Candidates must have deep expertise in Cu backend integration and NPI to HVM ramp. The position offers access to state-of-the-art lab facilities and opportunities for research publication.
TAL's take
High-impact research role at a prominent research institute with well-defined technical scope and clear expectations for a senior specialist.
Very clear role definition focusing on advanced packaging and heterogeneous integration with specific technology and methodology requirements.
Must haves
- Bachelors or Masters in Engineering, Physics, Chemistry or related field
- 5-10 years semiconductor experience
- Expertise in Cu backend integration
- Exposure to advanced packaging technologies
- Proficiency with DOE and SPC (JMP/Minitab)
- NPI to HVM ramp experience
Tools and skills
Nice to have: lithography, etch, deposition, electroplating, cmp, wafer thinning, dicing, failure analysis flows.
About the company
Prestigious government research agency in Singapore, strong domain reputation but not a commercial product entity.
Posts mentioning A*STAR - Agency for Science, Technology and Research
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