Engineer, Senior (Technology Integration - Wafer-level Packaging)
This role at Qualcomm involves end-to-end development, qualification, and high-volume manufacturing transfer of new semiconductor processes and materials. The successful candidate will lead integration projects, define process requirements using DOE and SPC, and drive yield improvements. You will work as a subject matter expert, coordinating across functional teams to ensure ramp-readiness and reliability. The position requires strong data analytics skills and experience in wafer-level packaging.
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Experience
3+ years
Function
Engineering
Work mode
Onsite, Singapore
Company
Tier 1
What you will work on
This role at Qualcomm involves end-to-end development, qualification, and high-volume manufacturing transfer of new semiconductor processes and materials. The successful candidate will lead integration projects, define process requirements using DOE and SPC, and drive yield improvements. You will work as a subject matter expert, coordinating across functional teams to ensure ramp-readiness and reliability. The position requires strong data analytics skills and experience in wafer-level packaging.
TAL's take
Role at a Tier 1 global semiconductor leader with clear technical ownership in process integration and wafer-level packaging.
Very well-defined responsibilities, clear technology stack, and specific experience requirements for semiconductor manufacturing.
Salaries at Qualcomm
27.4 LPA average
Based on 637 Grapevine salary entries for Qualcomm.
Engineering
0 - 2 years | L1
15 LPA average
Range: 12 - 20 LPA
Engineering
2 - 4 years | L1
18 LPA average
Range: 8 - 32 LPA
Engineering
4 - 6 years | L1
21 LPA average
Range: 10 - 31 LPA
Engineering
6 - 8 years | Lead
30 LPA average
Range: 20 - 50 LPA
Must haves
- Bachelor’s or Master’s degree in Engineering
- 3+ years experience in process integration or high volume manufacturing
- Experience with wafer-level packaging technology
- Strong skills in DOE, SPC, data analytics, and FMEA
- Project leadership for technology integration
Tools and skills
Nice to have: lean, six sigma, 8d, dmaic, mems.
About the company
Qualcomm is a global leader in semiconductor technology and a well-known Tier 1 engineering organization.
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