R&D Director - Semiconductor Equipment
This R&D Director role at AAC Technologies focuses on leading full-cycle R&D for hybrid bonding equipment within the semiconductor packaging domain. The successful candidate will oversee architecture design, precision mechanism integration, and team management while coordinating with regional fabs. The role requires deep expertise in nano-level alignment and vacuum system design, alongside fluency in English and Chinese. It serves as a key leadership position for driving technical breakthroughs and localized mass production efforts.
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Experience
10+ years
Function
Engineering
Work mode
Onsite, Singapore
Company
Tier 2
What you will work on
This R&D Director role at AAC Technologies focuses on leading full-cycle R&D for hybrid bonding equipment within the semiconductor packaging domain. The successful candidate will oversee architecture design, precision mechanism integration, and team management while coordinating with regional fabs. The role requires deep expertise in nano-level alignment and vacuum system design, alongside fluency in English and Chinese. It serves as a key leadership position for driving technical breakthroughs and localized mass production efforts.
TAL's take
High-impact Director role at a major semiconductor equipment supplier with clear technical and leadership requirements.
The JD is highly specific regarding technical domains like hybrid bonding, nano-level alignment, and specific industry applications like HBM/Chiplet.
Must haves
- 10+ years semiconductor packaging equipment R&D experience
- 5+ years Hybrid Bonder complete machine development experience
- Expertise in nano-level alignment and vacuum system design
- Fluent English and Chinese
- Experienced in R&D team management and project management
Tools and skills
Nice to have: local semiconductor industry resources.
About the company
Established global supplier in the electronics and semiconductor industry with significant R&D operations.