Application / Process Engineer - Die Bond Tools
Capcon Limited Ltd. is seeking an Application/Process Engineer to support die bonding equipment in the semiconductor industry. You will lead the design, optimization, and validation of hardware and software applications for advanced bonding processes. The role involves cross-functional collaboration, root cause analysis, and providing technical support for customer installations. It requires hands-on experience in semiconductor equipment integration and motion control systems.
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Experience
3+ years
Function
Engineering
Work mode
Onsite, Singapore
Company
Tier 2
What you will work on
Capcon Limited Ltd. is seeking an Application/Process Engineer to support die bonding equipment in the semiconductor industry. You will lead the design, optimization, and validation of hardware and software applications for advanced bonding processes. The role involves cross-functional collaboration, root cause analysis, and providing technical support for customer installations. It requires hands-on experience in semiconductor equipment integration and motion control systems.
TAL's take
Solid technical role in a specialized semiconductor domain with well-defined responsibilities, though the company brand impact is limited.
The JD clearly defines the application/process engineering role within the die bonding context with specific technical responsibilities.
Must haves
- Bachelor’s or Master’s degree in Engineering
- 3+ years experience in semiconductor packaging or die bonding equipment
- Knowledge of advanced packaging technologies
- Experience with semiconductor equipment integration and motion control systems
- Hands-on troubleshooting and problem-solving skills
Tools and skills
Nice to have: flip-chip bonding, pop bonding, wafer-level bonding, panel-level bonding.
About the company
Unfamiliar company in the semiconductor equipment space, categorized as tier 2 mid-stage or established niche provider.