Senior Scientist II (Advanced Packaging), IME
A*STAR is recruiting Research Scientists to develop high-bandwidth, energy-efficient optical interconnects for next-generation AI clusters. The role involves 2.5D/3D electronic-photonic integration, package architecture design, and thermal/link performance optimization. Candidates must have expertise in semiconductor packaging, silicon photonics, or high-speed interface design. The project aims to push optical I/O capabilities beyond 100 Tb/s for hyperscale data centers.
50k new jobs listed every day. Install TAL to find more jobs like this.
Experience
Experience not specified
Function
Research
Work mode
Onsite, Singapore
Company
Tier 2
What you will work on
A*STAR is recruiting Research Scientists to develop high-bandwidth, energy-efficient optical interconnects for next-generation AI clusters. The role involves 2.5D/3D electronic-photonic integration, package architecture design, and thermal/link performance optimization. Candidates must have expertise in semiconductor packaging, silicon photonics, or high-speed interface design. The project aims to push optical I/O capabilities beyond 100 Tb/s for hyperscale data centers.
TAL's take
High-impact research role in a reputable institution focused on cutting-edge AI infrastructure technologies.
Very clear focus on specific technical domains like 2.5D/3D packaging and optical interconnects for AI infrastructure.
Must haves
- advanced semiconductor packaging expertise
- silicon photonics or photonic integrated circuits knowledge
- high-speed electrical interface design experience
- thermal modelling and analysis proficiency
- hardware characterization and measurement skills
Tools and skills
About the company
A*STAR is a prominent research agency, classified as a tier 2 organization in the context of commercial tech industry hierarchy.