Director, Advanced Packaging Lab (HIT)
AMD is hiring a Director to establish and lead its new Advanced Packaging Lab in Singapore, focusing on AI product development. The role involves managing a multidisciplinary team across optical, electrical, mechanical, thermal, and imaging metrology domains. You will define the technical roadmap, collaborate with global engineering teams, and partner with external vendors and institutions. This is a strategic leadership position requiring deep semiconductor industry expertise and strong stakeholder management.
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Experience
Experience not specified
Function
Engineering
Work mode
Onsite, Singapore
Company
Tier 1
What you will work on
AMD is hiring a Director to establish and lead its new Advanced Packaging Lab in Singapore, focusing on AI product development. The role involves managing a multidisciplinary team across optical, electrical, mechanical, thermal, and imaging metrology domains. You will define the technical roadmap, collaborate with global engineering teams, and partner with external vendors and institutions. This is a strategic leadership position requiring deep semiconductor industry expertise and strong stakeholder management.
Must haves
- Extensive experience in advanced packaging, metrology, and characterization
- Experience in design validation of semiconductor components and platforms
- Proven track record managing and scaling technical teams
- Strong network within the Singapore tech ecosystem
- Ability to effectively engage and influence US-based partner teams
- Bachelor/Master in Mechanical/Electrical Engineering, Material Science, or Physics
Tools and skills
Nice to have: agentic ai.
About the company
AMD is a leading global semiconductor company and major industry player.